| abstract |
A laminate of a heat resistant film and a metal foil according to the present invention is formed by a heat resistant film and a metal foil laminated together via a cured layer of a terminal-modified oligomer, the metal foil being provided on one or both sides of the laminate, wherein the cured terminal-modified oligomer is a heat reaction product of a terminal-modified oligomer obtained by concurrent or sequential reactions of a tetracarboxylic acid dianhydride and a diamine in a molar ratio of n: (n + 1) (wherein, n is from 2 to 6), and a carboxylic acid compound containing an unsaturated group. This laminate of a heat resistant film and a metal foil can be manufactured with ease, has excellent adhesive properties, and also exhibits excellent thermal resistance capable of withstanding high-temperature processes such as soldering and chip mounting. |