| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| filingDate |
2007-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd49ded2b40c13487c4485dc3cb588f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6617fd0c156d02a9ec3ea81cc60f2fef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c14032f66207a68956f2cb9eaf2b4bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b247c2bd4ed79e8a7aa1c7bd6526f56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2018d0573bb9c42b1b95a711fac154b |
| publicationDate |
2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200829094-A |
| titleOfInvention |
Circuit connecting material, connection structure for circuit member using the same and production method thereof |
| abstract |
Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of second circuit electrodes are formed on a major surface of a second circuit board so that the first circuit electrodes are electrically connected with the second circuit electrodes in such a manner that the first and second circuit electrodes face each other. The circuit connecting material contains an adhesive composition, a conductive particle, and a plurality of insulating particles containing one or both of a polyamic acid particle and a polyimide particle. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I495414-B |
| priorityDate |
2006-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |