http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200828617-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_57072bf9a3e1aa2c1cb9fc8ef5c44db2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate | 2006-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcea1c44c1ec72b359b2654836157c25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75cd6dca1e43bf138e2b924bd7fd196a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e444b2bfdefd0f153884e0ef675171a |
| publicationDate | 2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200828617-A |
| titleOfInvention | LED assembly and method of fabrication |
| abstract | An LED assembly includes a heat dissipation device and at least one LED. The heat dissipation device has a mounting surface directly forming a circuitry thereon. The at least one LED is electrically connected with the circuitry, and heat generated by the LED is dissipated through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a mounting surface for the LED to be mounted thereon; (B) insulating the mounting surface; (C) forming a circuitry on the mounting surface directly; (D) connecting the LED with the circuitry of the heat dissipation device electrically to form the LED assembly. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10948135-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I426202-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8684566-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I467737-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8491165-B2 |
| priorityDate | 2006-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.