http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200824524-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_430cd536abc769419a4f0b79f71b86ba |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2006-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9123d3a26a990685fd6091ab25d05695 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dec3ee6991c286821b5841f3d2767d63 |
| publicationDate | 2008-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200824524-A |
| titleOfInvention | Circuit board bond pad structure and fabrication method thereof |
| abstract | A circuit board bond pad structure and a method of fabricating the same are disclosed. The circuit board bond pad structure includes a core layer, a bond pad disposed on the core layer, a solder-resistant layer covering the core layer and a portion of the bond pad. The solder resistant layer, which covers partial of the bond pad, divides the bond pad into at least two sub-bond pad areas. When the conductive material and electronic components disposed on the sub-bond pad area are electrically connected and a high-temperature re-soldering process is performed, the circuit board bond pad structure of the present invention is capable of guiding bubbles formed by the high-temperature re-soldering process to the gap formed between the solder-resistant layer that covers partial of bond pad, the conductive material and electronic components, thereby solving the problem of insufficient soldering bonding caused by the formation of bubbles that may affect stability and degrade the quality. |
| priorityDate | 2006-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.