http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200820374-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5dabfc7998cca69e04571256e5cb4e80 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d18bd377ed3682ec403834c937fba28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97dbe03c85b95a2e6c74cc7ecd6b75c2 |
| publicationDate | 2008-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200820374-A |
| titleOfInvention | Conductive structure of package substrate and manufacturing method thereof |
| abstract | A conductive structure of a package substrate is disclosed. The conductive structure comprises a seed layer disposed on plural conductive pads of a substrate, wherein the substrate having the conductive pads and a insulating layer thereon, and the insulating layer has plural openings to expose the conductive pads; and a metallic layer disposed on the first seed layer. In this conductive structure, the seed layer is preferably achieved by forming a copper layer on the substrate by chemical plating, and then replacing the copper layer with a silver layer or a gold layer. Therefore, the quality of the surface between the metallic layer and the conductive pads can be improved, and the reliability of the package substrate is increased. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I494037-B |
| priorityDate | 2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.