| abstract |
A chip and a manufacturing method t hereof are provided. The chip has an active surface. The chip includes at least a connecting element and a pillar-like bump. The connecting element disposed on the activate surface has a max dimension smaller than 100 microns. The bump is disposed on the connecting element. The bump includes a pillar part disposed on the connecting element and a top part disposed on the pillar part. The pillar part has a first dimension and a second dimension, which are parallel with the active surface. The first dimension is longer than 1.2 times the second dimension. The pillar part will not melt under a determined temperature. The top part is composed with solder and will not melt under the determined temperature. |