| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64f865523ae8fb5ef8dfabb540489ca3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5ff4ce5fc8965b8abfd2c2ad68eba03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19fbaca4621c051b5fdc1c4e98b872b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d8f64068d9f07879b3b7db93a5d3583
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6b4e0e999d9e9e8ee8fbe7d244f60cb |
| publicationDate |
2008-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200816235-A |
| titleOfInvention |
Heat-conductive dielectric polymer composition and heat dissipation substrate containing the same |
| abstract |
A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I482929-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111279802-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111279802-A |
| priorityDate |
2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |