| abstract |
The present invention relates to a polyimide composite flexible board and a process for preparing the same, the process comprises sequentially applying polyamic acids each having a glass transition temperature of from 280 to 330 DEG C and from 190 to 280 DEG C on a metal foil, then subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with each other or with additional metal foil to produce a polyimide composite flexible board. According to the present invention, it can obtain a polyimide composite flexible board having excellent mechanical property, high heat resistance, and excellent dimension stability without using adhering agent. |