| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d34fa1d0e297c04904926b0a787ecab1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-335
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14 |
| filingDate |
2006-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33c82ef09968e9206444560bd3bba2e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a00780a9aceae4dbc10af7a76e7e7048 |
| publicationDate |
2008-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200814758-A |
| titleOfInvention |
Structure of image sensor module and a method for manufacturing of wafer level package |
| abstract |
The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and a flexible printed circuits (FPC). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens is placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the FPC, and the FPC has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9735135-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I462280-B |
| priorityDate |
2006-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |