| abstract |
The present invention provides a stacked chip package structure with lead-frame having bus bar with transfer pad, comprising: a lead-frame composed of a plurality of group of inner leads arranged oppositely, a plurality of group of outer leads, and a die pad, wherein the die pad is disposed among the plurality of group of inner leads arranged oppositely, and a height difference is formed between the die pad and the plurality of group of inner leads arranged oppositely; a stacked chip package structure is formed with a plurality of chips stacked together and is disposed on the die pad, the plurality of chips and the plurality of group of inner leads arranged oppositely being electrically connected with each other; and an encapsulant is used to encapsulate the stacked chip package structure and the lead-frame; wherein the lead-frame comprises at least a bus bar, which is disposed between the plurality of group of inner leads arranged oppositely and the die pad, and the bus bar is further coated with an insulating layer, and a plurality of metallic bonding pads are selectively formed on the insulating layer. |