| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7e0b4d462bb40740e58518faa22659d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b747978464b20e0d5cfe78706dd5f14d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e709d7738f88d630d65e6882ac887fa |
| publicationDate |
2008-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200813128-A |
| titleOfInvention |
Thermosetting polyimide resin composition |
| abstract |
Provided is a thermosetting polyimide resin composition which, when used for an adhesive layer of a metal-clad laminate, does not need a imidization step at 300 DEG C or more and can be produced by merely solvent removal. It has thermosetting property, the hardened article thereof is excellent in adhesiveness, and it has low water absorption and good heat resistance. A thermosetting polyimide resin composition comprising a polyimide resin having a repeating unit of specific structure and a compound having two or more polymerizable double bonds in one molecule; a film containing the thermosetting polyimide resin composition; and a metal-clad laminate containing an adhesive layer made from the thermosetting polyimide resin composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I593754-B |
| priorityDate |
2006-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |