| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2007-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ee52f56f00731be9c1cfc864a4414e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5476aa361a110081e0e8e1dd25cece18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55809532badf84b169aa0d2a06573dd1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_157cc8465059fd4a74a10e7f2dc6f94f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9f3ba16e99fff64c09255e817c1a31c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_689d962277b9027a64f7092d809c3f60 |
| publicationDate |
2008-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200811938-A |
| titleOfInvention |
Method for processing a semiconductor device |
| abstract |
A process for forming backside illuminated devices is disclosed. Specially, the process reduces processing damage to wafers caused by poor bond quality at the wafer edge ring. In one embodiment, a wafer edge trimming step is implemented prior to bonding the wafer to the substrate. A pre-grind blade is used to create a straight edge around the wafer perimeter, eliminating any sharp edge. In another embodiment, edge trimming is performed after the wafer has been bonded to the substrate, and a pre-grind blade is used to remove portion of the wafer edge ring subject to poor bonding quality before grinding. The final thickness of the ground wafer is about 50 microns in either case. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8778778-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I456639-B |
| priorityDate |
2006-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |