http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200806820-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86dc9c9f208867a10f82d3b99e58a4b6
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
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filingDate 2006-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d1f498aab69b3fd61e613f4c942e30a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_191be582506035ce13da0f0c66da6015
publicationDate 2008-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200806820-A
titleOfInvention Whisker preventing agent for tin or tin alloy plating and whisker preventing method using the same
abstract To provide a simple means for surely preventing the occurrence of whiskers after the performance of tin or tin alloy plating, even in the case it is left at room temperature for 5,000 hr. The whisker preventive for tin or tin alloy plating comprises: (A) sulfuric acid, alkane sulfonic acid, alkanol sulfonic acid or their derivatives; (B) peroxide; and (C) metal ions whose electric potential is nobler than that of copper. In the whisker preventing method for tin or tin alloy plating, the stock to be plated is dipped into the whisker preventive for tin or tin alloy, and is thereafter subjected to tin or tin alloy plating.
priorityDate 2005-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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