| abstract |
The present invention provides a method of forming metal pattern that includes (a1) providing a polymer layer above a substrate, (a2) applying a metal ion or the salt thereof the polymer layer, (a3) reducing the metal or the salt thereof to form a conductive layer, (a4) forming resist layer shaped into a pattern above the conductive layer, (a5) electroplating to form a metal pattern in regions where the resist layer is not formed, (a6) removing the resist layer, (a7) removing the conductive layer form regions that were protected by the resist layer, and (a8) performing hydrophobizing treatment. |