http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200804527-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_31b788312cfcc435eb42e1ca6e83dd28 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 |
filingDate | 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fb4225d212d95c04ea15c93c626d58 |
publicationDate | 2008-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-200804527-A |
titleOfInvention | The printed circuit board composition of polybutadiene thermosetting resin and its manufacture |
abstract | This invention is about a composition for high performance printed circuit board. Which includes 20~35 wt% of high molecular weight of polybutadiene with high vinyl groups, low molecular weight of polybutadiene, cyclic olefin copolymer with two or above vinyl groups,and/or thermosetting polymer resin which was polymerized from acrylic acid, acrylontrile and butadiene; 10~30 wt% glass fiber cloth; 25~50 wt% inorganic particulate filler; 1~10 wt% metallic coagents; 10~30 wt% bromine-containing fire retardant. Using solvents to dilute the composition to the suitable viscosity. After the prepreg had been made by impregnation, the electric circuit board composition with excellent properties can be obtained by laminating at 170~220 DEG C with 20~50 kg/cm2. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I796337-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11634529-B2 |
priorityDate | 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.