http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200804516-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_31b788312cfcc435eb42e1ca6e83dd28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fb4225d212d95c04ea15c93c626d58 |
| publicationDate | 2008-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200804516-A |
| titleOfInvention | Syntheses of novel dihydrobenzoxazine thermosetting resins and its applications |
| abstract | This invention is composition of an epoxy vanish with high Tg applied to laminated boards. The composition includes (A) a novel dihydrobenzoxazine thermosetting resin, which is generated from the reaction of the following compounds: (i) a phenolic product generated from difunctional or multifunctional epoxy resin react with difunctional phenolic compound; (ii) mixed primary amine compound with monofunction and difunction; (iii) a difunctional phenolic compound; and (iv) a formaldehyde or paraformaldehyde compound; (B) one or various kinds of epoxy resin(s); (C) novolac-curing agent; and (D) the curing accelerator. Because of the thermosetting resin compound "modified dihydrobenzoxazine" is multifunctional in the epoxy resin varnish composition, that can increase the crosslinking with resins to improve the mechanical intensity and heat resistance of base plates obviously. And resolve the bad solubility of dihydrobenzoxazine in the solution to increase the production efficiency sharply. Moreover, using the novolac-curing agent can reduce the curing temperature for dihydrobenzoxazine compound and epoxy resin, and advance the crosslinking completely with epoxy resin. This epoxy resin composition in this invention can improve the high Tg, low water absorption, outstanding heat resistance and pass the UL94 V-0 flame resistance test. That can be applied to high performance electronic materials widely. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I400297-B |
| priorityDate | 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 110.