| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65147f09c27bafad8eaa268c044a25ff |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5425 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
| filingDate |
2007-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_519d9072080f85557904e9c750743a5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5df63c8ca84abef604f59cdbcfa714c1 |
| publicationDate |
2008-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200801816-A |
| titleOfInvention |
Photosensitive resin composition |
| abstract |
A photosensitive resin composition which is useful especially as a buffer coating material for LSI chips; and a resin film obtained from the photosensitive resin composition. The photosensitive resin composition comprises: 100 parts by weight of a polycondensate obtained by condensation-polymerizing compounds represented by specific chemical formulae in a specific proportion; 0.01-5 parts by weight of a photopolymerization initiator; and 1-30 parts by weight of a specific organosilane. The resin film is obtained by applying the photosensitive resin composition to a silicon wafer surface and subjecting the coating to exposure to light, development, and curing. |
| priorityDate |
2006-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |