| abstract |
A porous composite material useful in semiconductor device manufacturing, in which the diameter(or characteristic dimension) of the pores and the pore size distribution (PSD) is controlled in a nanoscale manner and which exhibits improved cohesive strength (or equivalently, improved fracture toughness or reduced brittleness), and increased resistance to water degradation of properties such as stress-corrosion cracking, Cu ingress, and other critical properties is provided. The porpous composite material is fabricating utilizing at least one bifunctional organic porogen as a precursor compound. |