| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03912
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2006-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a41ed4ce9725fda45c758ce288a69a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00fc10680d6add3d6092f7695ddd32ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38f6143ae67472ff3c70f5a065cb575f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_983eee04a441b1030326bbda7e6a30d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4697c6a730bfe0488fb833a77d08cd71 |
| publicationDate |
2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200739767-A |
| titleOfInvention |
Methods for forming a solder bump on a bond pad and an interconnection structure for a semiconductor device |
| abstract |
An under bump metallurgy (UBM) structure formed over a bond pad and for use in conjunction with a solder ball, provides an upper copper layer over a subjacent composite film that includes a nickel film over a further copper film over a titanium film. One or more reflow operations are used to form a molten solder ball and conditions are selected to ensure that all the copper from the upper copper layer is dissolved within the molten solder ball. For SnAg leadfree solder, this leads to the formation of SnAgCu-like leadfree solder. The resulting interface between the solder ball and the nickel layer includes regularly spaced Cu6Sn5 nodules as intermetallics but is free of Ni3Sn4 which can spall into the molten solder causing reliability problems. |
| priorityDate |
2006-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |