abstract |
The present invention provides a positive photosensitive resin composition comprising (A) an alkali soluble resin, (B) a diazoquinone compound, (d1) an active silicon compound and (d2) an aluminum complex. Further, the present invention also provides a positive photosensitive resin composition comprising (A) an alkali soluble resin, (B) a diazoquinone compound, (C) a compound containing two or more oxetanyl groups in one molecule and (D) a catalyst for accelerating the ring opening reaction of the oxetanyl groups contained in the compound (C). |