| abstract |
The present invention relates to an encapsulating material comprising an epoxy resin, a methylhexahydrophthalic acid anhydride and a ethyl triphenyl phosphonium bromide; to a packed solid state device, particularly a LED device, comprising the said encapsulating material; and to a process for encapsulating a solid state device, characterized in that the process comprises the step of using the said encapsulating material to encapsulate the device, whereby the solid state device is placed into a package. |