patent/TW-200723471-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200723471-A

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
filingDate	2006-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1e60ad7b1c4a538fd7d8d4eb4fada09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3d0c4337b768ae7f312a01280adc176 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cb56a3cefe97649b27df7359533b437 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6446cc527979e3c5e85f05e5454e36e0
publicationDate	2007-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-200723471-A
titleOfInvention	Strain silicon wafer with a crystal opientation (100) in flip chip BGA package
abstract	A method and system is disclosed for better packaging semiconductor devices. In one example, a semiconductor device package comprises a package substrate, at least one die with an orientation of (100) placed on the substrate with electrical connections made between the package substrate and the die, and an underfill fillet attaching the die to the substrate with the underfill fillet reaching less than 60% of a thickness of the die on at least one side thereof.
priorityDate	2005-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

Total number of triples: 47.