http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200710572-A

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filingDate 2006-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7720c3a05e269724fb4cde7bafe7c295
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publicationDate 2007-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200710572-A
titleOfInvention Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
abstract A photocuring/thermosetting resin composition comprising carboxylated resin (A), oxime ester photopolymerization initiator (B) having an oxime ester group, aminoacetophenone photopolymerization initiator and/or phosphine oxide photopolymerization initiator (C), compound (D) having two or more ethylenic unsaturated groups in each molecule, filler (E) and thermosetting component (F). This photocuring/thermosetting resin composition is developable with the use of a dilute alkali solution and can be cured or set by a laser emission source of 350 to 420 nm maximum wavelength.
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Total number of triples: 27.