| abstract |
This invention provides a photo-sensitive resin composition, which comprises (a) polyimide containing at least one selected from the group consisting of carboxy, phenolic hydroxy, sulfonic acid group and thiol on the terminal of main chain, (b1) polymeric compound with unsaturated bond represented by the general formula (1), and (c) photopolymerization initiator. The said composition can be used for forming polyimide film capable of development in alkali and having excellent heat resistance, strength and stretch. |