| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_399d433982220f3203f7f18db8c9aa28 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249992
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249989
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249991 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-14 |
| filingDate |
2006-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8466627721c91a9df638b5937e8d6414
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36ee227c4d75cbd4c2e432cafcd5addc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00dea4d0b2ec225b0afd2b35e7563087 |
| publicationDate |
2006-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200636848-A |
| titleOfInvention |
Cushion material for polishing pad |
| abstract |
This invention provides a cushion material for polishing pad, which is useful in semiconductive wafer having surface wave or wafer having part step produced in the circuit formation. The cushion material has low hygroscopicity and swelling ability and is not easily transformed by water in the polyurethane foam that is polished under uniform wafer surface and mile part step along the surface wave or step. The polyurethane foam is produced by the reaction of polyols and polyisocyanate. The contact angle to water is more than 90 degree. It is preferable using hydrophobic polyols in the polyurethane foam and form self skin layer. |
| priorityDate |
2005-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |