| abstract |
A method for bonding a plurality of substrates (145, 440, 450) includes performing a gas plasma treatment on the plurality of substrates (145, 440, 450), and performing a water plasma treatment on the plurality of substrates (145, 440, 450). Additionally, a system for performing low temperature plasma enhanced bonding includes a substrate housing structure having a substrate (145, 440, 450) receiving volume, a gas source fluidly coupled to the substrate housing structure, a water vapor source (230) fluidly coupled to the substrate housing structure, and a radio-frequency (RF) generator (260) coupled to the substrate housing structure, wherein the system is configured to perform both a gas plasma treatment and a water plasma treatment on a substrate (145, 440, 450). |