| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2889
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07378 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C29-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 |
| filingDate |
2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81641639e2f82c2827a28384f52daa16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0498a7fb5f4ccfb96c2a9f111717c9b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95b2743b31e5c2894a4113ef3a3cf122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69f82b3f54aa6e72514b2374a8db9a51 |
| publicationDate |
2006-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200604542-A |
| titleOfInvention |
Test board for high-frequency system level test |
| abstract |
A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main board from which an existing module socket has been removed. An interface board has surface mounted device (SMD) pads on front and rear surfaces. The SMD pads on the front surface of the interface board are connected with the SMD pads on the rear surface thereof through cross connection wiring within the interface board for a pin swap. The through holes of the main board are connected with the SMD pads on the rear surface of the interface board via iron cores fixed at a guide. A test module socket is mounted on surfaces of the SMD pads on the front surface of the interface board. |
| priorityDate |
2004-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |