| abstract |
The present invention provides a sheet-like probe, wherein stable connection state is achieved even for a circuit device having a small electrode with a fine pitch, wherein electrode structure bodies do not come out from an insulation film and high durability is achieved, wherein, in a burn-in test for a wafer having a large area and for a circuit device having the electrode to be inspected with the small pitch, positional displacement between the electrode structure bodies and the electrode to be inspected due to temperature variation can be securely prevented so that the superior connection condition is stably maintained. Each of the electrode structure bodies is composed of: a surface electrode section exposed to the surface of the insulation layer, projecting from the surface of the insulation layer, and having the shape whose diameter is reduced as it proceeds from the base end to the tip; a back surface electrode section exposed to the back surface of the insulation layer; and a short circuit section extending from the base end of the surface electrode section, continuously penetrating the insulation layer with respect to the thickness direction, and connected to the back surface electrode section. |