http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200539260-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-55
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2005-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88a31f5ee8364f2903d18ff3d343708f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b52489a4b513f5c35af8b90a5012b6cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfc407ce7cf7e7d2e6a2b7c40a13d323
publicationDate 2005-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200539260-A
titleOfInvention Metal-insulator-metal (MIM) capacitor structure formed with dual damascene structure
abstract A microelectronic product and a method for fabricating the same each provide a capacitor formed interposed between a first dielectric layer and a second dielectric layer formed over a substrate having a first contact region and a second contact region exposed therein. The capacitor is also connected to a first conductor stud that penetrates the first dielectric layer. A contiguous conductor interconnect and conductor stud layer is formed within a dual damascene aperture through the second dielectric layer and the first dielectric layer and contacting the second contact region. An etch stop layer employed when forming a trench within the dual damascene aperture also passivates a capacitor sidewall.
priorityDate 2004-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID166630
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458403899
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419575161
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID28117

Total number of triples: 22.