Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10674 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09854 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09845 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
filingDate |
2005-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77ca76a24479da869bc9a1cfda51df67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b75f2da6fd4e2ad7e5b247ffdcee359 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a6ff6335fe2421fa4143dec1e30f895 |
publicationDate |
2005-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-200534768-A |
titleOfInvention |
Connection structure of inner conductor and multilayer substrate |
abstract |
In case of prior art described in patent documents 2 and 3, positional shift between a via conductor and a line conductor or failure of connection due to processing error can be prevented by a connection land when a ceramic substrate is made because the line conductor or the via conductor is provided with the connection land. However, as the connection land (3) stretches from the via conductor (2) to the adjacent via conductor (2) side, as shown on Fig. 8(a), fine pitch between via conductors (2, 2) is prevented by a quantity of the stretch. In the inventive connection structure (10) of inner conductors for connecting first and second via conductors (12, 13) arranged contiguously to each other in a ceramic multilayer substrate (11) with a first line conductor (15) formed in the ceramic multi-layer substrate (11), the first via conductor (12) includes a first continuous via conductor (17) extended in the direction receding from the second via conductor (13) and the first via conductor (12) is connected with the first line conductor (15) through the first continuous via conductor (17). |
priorityDate |
2004-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |