patent/TW-200532824-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200532824-A

Outgoing Links

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assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81bbed339049c84138a09736b647d40e
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0379 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-1025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate	2004-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f86db35f0130c81c764c26303299169
publicationDate	2005-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-200532824-A
titleOfInvention	Bumping process, bump structure, packaging process and package structure
abstract	A bumping process, a bump structure, a packaging process and a package structure are described. The bump structure comprises a first solder portion, a second solder portion and a pseudo under bump metallurgy. The second solder portion is disposed on the first solder portion The pseudo under bump metallurgy is disposed between the first solder portion and the second solder portion. The present invention also describes the process of the bump structure to increase the height of bump structure. The bump structure also can be applied in the packaging structure and packaging process thereof to make the connection between chip and packaging substrate has high reliability.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106165553-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110634752-A
priorityDate	2004-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453935011 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57418177

Total number of triples: 59.