| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10734
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2137d29ab93d75558a8ccc8932ba9378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_194e0ffc73c31f794e9250b1a2d7cd9d |
| publicationDate |
2005-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200532760-A |
| titleOfInvention |
Substrate for mounting semiconductor |
| abstract |
A substrate (80) for mounting a semiconductor in which an IC chip (70) is bonded electrically through a highly rigid interposer (60) to an external pad (41) and an internal pad (43) formed on the uppermost surface of a built-up layer (30). When the IC chip (70) generates heat subsequently, a large shear stress is applied to the joint of the pad (41) and the interposer (60) as compared with that to the joint of the pad (43) and the interposer (60) because the pad (41) is separated from the center of the pad (41). Since the pad (41) is formed on a substantially flat wiring part, a void or a corner part susceptible to concentration of stress is not formed in a solder bump (51) when the pad (41) is bonded to the interposer (60) through the solder bump (51). Consequently, high bonding reliability can be attained. |
| priorityDate |
2004-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |