Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate |
2004-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5f9b483e10a996803a8b95e1f52dda5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb9f5ef849290052f477138080d21a6c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7355c0815fad49fc430d27fcb9eb662 |
publicationDate |
2005-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-200528234-A |
titleOfInvention |
Polishing apparatus |
abstract |
A polishing apparatus has a top ring (1) configured to hold a semiconductor wafer (W) on a substrate holding surface and a pusher (130) configured to deliver the semiconductor wafer (W) to the top ring (1) and receive the semiconductor wafer (W) from the top ring (1). The pusher (130) includes a push stage (133) having a substrate placement surface on which the semiconductor wafer (W) is placed and an air cylinder (135) configured to vertically move the push stage (133). The pusher (130) also includes a high-pressure fluid port (220) configured to eject a high-pressure fluid toward the semiconductor wafer (W). |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I447795-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I404166-B |
priorityDate |
2003-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |