http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200528234-A

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filingDate 2004-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5f9b483e10a996803a8b95e1f52dda5
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publicationDate 2005-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200528234-A
titleOfInvention Polishing apparatus
abstract A polishing apparatus has a top ring (1) configured to hold a semiconductor wafer (W) on a substrate holding surface and a pusher (130) configured to deliver the semiconductor wafer (W) to the top ring (1) and receive the semiconductor wafer (W) from the top ring (1). The pusher (130) includes a push stage (133) having a substrate placement surface on which the semiconductor wafer (W) is placed and an air cylinder (135) configured to vertically move the push stage (133). The pusher (130) also includes a high-pressure fluid port (220) configured to eject a high-pressure fluid toward the semiconductor wafer (W).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I447795-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I404166-B
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Total number of triples: 27.