http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200528232-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02
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filingDate 2004-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7cc003afe7294a60c7836781cfdfdd7
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publicationDate 2005-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200528232-A
titleOfInvention System, method and apparatus for applying liquid to a CMP polishing pad
abstract A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle. The liquid is substantially evenly sprayed from the nozzle onto the CMP polishing pad.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I411474-B
priorityDate 2003-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 22.