| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-3765
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2005-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f27a854046269c1c95d520f9df10fd5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c7740cff558a2d38ef00192c8f05a98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8382f19a5bb23f13b53ac198ffadc45b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c5d56c6c033d9fd7b104c7056105aba |
| publicationDate |
2005-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200527519-A |
| titleOfInvention |
Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device |
| abstract |
A cleaning composition comprises organic polymer particles (A) having a cross-linked structure and a surfactant (B) and is used after chemical mechanical polishing. A cleaning method of a semiconductor substrate is a method for cleaning semiconductor substrate given after chemical polishing, by the use of the cleaning composition. A process for manufacturing a semiconductor device including a step of chemically and mechanically polishing a semiconductor substrate and a step of cleaning the semiconductor substrate obtained after the chemical mechanical polishing, by the cleaning method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I741139-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11377627-B2 |
| priorityDate |
2004-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |