http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200526816-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_41e6797bc3bd4a942be804049a3a463c
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filingDate 2004-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d406d32010d7d1a6dfaf2fcb9c63d7a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9dbcd77e7ee5d5ef0d29c203cb24fca
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publicationDate 2005-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200526816-A
titleOfInvention Development and application of the silver electroplating in a cyanide-free bath at room temperature
abstract In this innovation a new electrolyte composition for silver electroplating has been developed, in which we used silver halide to substitute the traditional silver cyanide used in traditional electroplating technique. In this innovation, the electrolyte composition was composed of silver chloride, lithium chloride, hydrochloride and a few EDTA or additives as the brightening agent. Silver-white colored Ag deposit could be plated onto a metallic substrate was established, such as austenitic stainless steel, copper, brass ... etc, and good adherence with the substrate. Since high purity silver deposit could be obtained by using the present electrolyte, the electroplating could be conducted at room temperature, and, the most importantly, the electrolyte employed is cyanide-free processing, the present electroplating technique is obviously suitable for high-quality silver on parts used in optical-electrical and semiconductor devices. The cyanide-free electrolyte creates a non-toxic environment, an enables safe operation which complying readily with the waste electrolyte-disposal regulations.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I513864-B
priorityDate 2004-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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