http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200525660-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aee67fd4ed6f1faed77fe335893c02ae
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
filingDate 2004-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c33f4446c7356440f919cf1838d7451
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63d9a2d069801febbf46945db66ad4f9
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publicationDate 2005-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200525660-A
titleOfInvention Upper object packaging method for backend process of image sensor
abstract The present invention relates to an upper object packaging method for backend process of image sensor, which includes using carbon dioxide to clean the surface of an image sensor object to be packaged in an inner environment with clean layer flow control; using two sets of visual systems to perform precise alignment on the surface of the upper object to be mounted; aligning and adhering the upper object to the image sensor object to be packaged at a predefined bonding position; and, after real-time pre-bake, pre-heat and alignment, completely securing the upper object onto the image sensor object to be packaged by thermal pressing means. Thus, it is able to ensure precise alignment and cleanness for packaging image sensors, and enhance the bonding strength of the product, thereby increasing the product yield of the packaging process.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I743429-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I605527-B
priorityDate 2004-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.