http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200525048-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28
filingDate 2004-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_312d220189941f5389e63f4d3a297641
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publicationDate 2005-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200525048-A
titleOfInvention Non-electrolytic pre-plating treating agent, non-electrolytic plating method using the agent and non-electrolytic plating product
abstract The purpose of this invention is to provide a non-electrolytic pre-plating treating agent which is able to dissolve in organic solvents and is stable, to provide a non-electrolytic plating method using said agent and resulting in excellent adhesion, and to provide the product of non-electrolytic plating. The non-electrolytic pre-plating treating agent comprises a noble metal soap containing lipid acids having carbon numbers from 5 to 25. Further it is preferable to use a silane coupling agent containing metal trap capability in it, such as imidazoles silane coupling agent and the like, to pre-treat plating product performing non-electrolytic plating. The noble metal soap is preferable a palladium soap.
priorityDate 2004-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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