| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06 |
| filingDate |
2004-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d839018f8ce1e1df25ebb714379d4ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0404f734ae876eb23bfedabca2abc0c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7449f7938ca9fd8dbfe4a8cb0cf75111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0c7651d1940c50ceb710a27e5315356
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5bec54a5f3798bdac147cdd54a0c5c3 |
| publicationDate |
2005-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200524679-A |
| titleOfInvention |
Substrate attaching method |
| abstract |
A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer W. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer 1. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80 DEG C. by using an oven. The thickness of the adhesive layer 1 is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer W. Next, a supporting plate 2 is attached to the semiconductor wafer W on which the adhesive layer of a desired thickness has been formed. |
| priorityDate |
2003-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |