| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-82 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34 |
| filingDate |
2004-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2968cfb219d2861a4e7d3e7facb8ec71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3927b32953e2866169c6448f15c6361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a78977e351f29e972f1c70124bd5807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b358ecee9b45bf7f5e879d5c97a208e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a8f49c21038ad30c31bcb545047688a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccc21078277336617a795950a1d5b81f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c62d1315a9b10214a3970368b17eba5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f5c126eede7bd644a548811548fa08a |
| publicationDate |
2005-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200524115-A |
| titleOfInvention |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
| abstract |
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I743449-B |
| priorityDate |
2003-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |