| abstract |
The invention realtes to a wafer level package for chips with chip edge protection, comprising individual chips which can in each case be mounted on a suitable carrier board, and to a method for producing such a wafer level package. The object is to present a wafer level package which eliminates the disadvantages of the prior art, eliminates problems of thermal mismatch and of board level reliability, allows the accomplishment of adequately thin structures and allows dependable protection of the chip edges. Furthermore methods with which such a wafer level package can be accomplished are to be presented. This is achieved by the chip (1) being thinned extremely from the back side and bonded onto a fibre reinforced synthetic resin sheet (4), forming a solidly bonded assembly that connot come apart in the customary temperaure range, and the edges of the assembly (4) being at least partly coated with a polymer (8). |