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filingDate 2004-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd69a96516141eb78c08cd7b72463faa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64147a0dcbe3174aa885c02be38d543c
publicationDate 2005-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200521270-A
titleOfInvention Electrolytic stripping method
abstract The present invention provides an electrolytic stripping method comprising electrolytically stripping: a copper plating film exposed from a silver plating film that partially covers a copper plating film formed on the entire surface of a member; and leaking silver formed on an exposed portion of the copper plating film and having a smaller thickness than the silver plating film, using the copper plating film as an anode, wherein the electrolytic stripping is carried out using a cyan compound-free electrolytic copper-stripping liquid, and the electrolytic stripping liquid comprises a compound capable of forming, with silver, a complex ion that is more easily dissociated than a complex ion of silver and cyan; and wherein silver and copper are deposited on a cathode which is used as a counter electrode to the anode and which is made of a metal that is chemically stable against the electrolytic stripping liquid.
priorityDate 2003-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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