| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2998
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2991
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12535
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-256 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-207 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2004-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e1aeccca6f9c378cd207558a87a23f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ba7b29972beebc463e3345f3655bcbd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e93ac14b7b2ef09a6b98272d6b3dbfc |
| publicationDate |
2005-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200521171-A |
| titleOfInvention |
Resin particles and resin layer containing metal micro particles, its forming method and circuit base board |
| abstract |
Provided is metal-containing resin particle for forming a conductor pattern in which the metal particles are dispersed in a resin matrix, and the content of the metal particles is 70 wt % or less. |
| priorityDate |
2003-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |