| abstract |
A negative photoresist composition for spinless(slit) coating is disclosed. The negative photoresist composition includes 5~50 parts by weight of acrylic binder resin, 2~200 parts by weight of multifunctional monomer containing unsaturated aliphatic groups, 0.005~100 parts by weight of an photoinitiator, 0.001~5 parts by weight of silicon compound containing epoxy or amine group, and 0.001~5 parts by weight of fluorine-based or silicon-based surfactant. A solvent is added to the composition so that viscosity becomes 2~20 cps. The negative photoresist composition may form a uniform coating layer without any coating defects when a layer such as an organic insulating layer is formed on a substrate with a spinless coater, and is easy to control edge profile of the coating layer. |