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filingDate 2004-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200427649-A
titleOfInvention Cover glass for semiconductor package and manufacturing method thereof
abstract A cover glass for semiconductor package 10 has: a first transmission face 10a and a second transmission face 10b in thickness direction, and side face 10c. The size of the cover glass is 14×16×0.5 mm, the first transmission face 10a and the second transmission face 10b is the face without polishing, and the surface roughness are less then 0.5 nm.
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