http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200426380-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f6d34b110119f3718fc1924e84b56fb http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_df6a7983dd4e616c5af8ad4e3e827006 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2003-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59d32251752ca8a87a37b665c7915c72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c76c7f58ad9ae6b651f521f19a1368d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2047fcb7e8ca566f329cc5df3bf939e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e73148e1906fd88df709fc7c6f596d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f87a277deaa322bd8925d2898d1bdb3b |
| publicationDate | 2004-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200426380-A |
| titleOfInvention | Modular probe head |
| abstract | A modular probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having a probing surface and a mounting surface. A plurality of electrical vias in grid array is formed between the probing surface and the mounting surface, which have silica layers in the via laterals. The probing surface forms a plurality of contact elements. The mounting surface forms a plurality of connect terminals. The connect terminals are electrically connected to the contact elements by the electrical vias, so that the mounting surface of the probe head enables to be modularly mounted and electrically connected to an interface board of the probe card. |
| priorityDate | 2003-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.