| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F20-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-10 |
| filingDate |
2004-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_453388cc8a7b6a8edf9017a251afc1ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_791da1c178e29a78d4e4e00c501d813b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c89b2d68dfdab8d2b65742dbc9b5029a |
| publicationDate |
2004-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200424768-A |
| titleOfInvention |
Photocuring/thermosetting ink jet composition and printed wiring board using same |
| abstract |
A photocuring/thermosetting inkjet composition contains (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in the molecule, (B) a photoreactive diluent other than the component (A) having a weight-average molecular weight of not more than 700, and c a photopolymerization initiator, and has a viscosity of not more than 150 mPa.s at 25 DEG C. A solder resist pattern is directly drawn on a printed wiring board by an inkjet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy beam and then further cured by heat. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107075286-A |
| priorityDate |
2003-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |