http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200422435-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c2ffabb9ee8910f9b8da6fe911d37fb0 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0591 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-149 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F11-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2003-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b957c0a7e3707eac380bd0af106d616 |
| publicationDate | 2004-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200422435-A |
| titleOfInvention | Aqueous solution of organic solderability preservative containing soldering promotion agent |
| abstract | The present invention relates to an aqueous solution of organic solderability preservative, comprising an alkyl- or aryl-substituted benzimidazole, an organic or inorganic halide as soldering promotion agent, a carboxylic acid and a metal salt. Said organic or inorganic halide as soldering promotion agent is capable of significantly elevating the soldering performances of the alkyl- or aryl-substituted benzimidazole. An organic solderability preservative film with a thickness from 0.1 to 1.0 μm can be formed on the copper surface of a printed circuit board when the copper surface is immersed into the aqueous solution of organic solderability preservative at a temperature from 20 to 60 DEG C for 0.1 to 5 min. Said organic solderability preservative film, even after subjected to baking at 155 DEG C for 4 hrs, three reflows, or 10 cycles (3 days) at 65 DEG C and 94% relative humidity (RH), is still excellent in solderability for a tin-lead solder and a lead-free Sn-Ag-Cu solder. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9511454-B2 |
| priorityDate | 2003-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 233.