| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 |
| filingDate |
2004-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63c204a0766c281f7c6627c4f0143268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1beb2190d40d4843204afe62859d7a24 |
| publicationDate |
2004-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200418354-A |
| titleOfInvention |
Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method |
| abstract |
A first semiconductor chip is attached to a first side of a printed circuit board, and a second semiconductor chip is attached to a second side of the printed circuit board opposite the first side of the printed circuit board. A mold is then used to form a first mold cavity which contains the first semiconductor chip over the first side of the printed circuit board, and to form a second mold cavity which contains the second semiconductor chip over the second side of the printed circuit board. The first and second mold cavities are simultaneously filled with a fill material via a mold inlet, where the mold inlet is at least partially defined through an aperture in the printed circuit board from the first side to the second side. |
| priorityDate |
2003-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |