| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate |
2003-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17f0e85316718e600149e8c5b2f6e4a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_521b7c8219022860984a45e0010a5bf0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ec7f69c42959edb47eff4c2b947e9ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d404cfcd68dbb6c6f6219e1edd46340
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02fc8389c553ab3670e393f25c29892a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f54ced330687db8d6154a159f6ed8bd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24e89f8ea2757254436ef7e07523c053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_642e6c1d9368f1e4a8c9a6ea48254426 |
| publicationDate |
2004-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200417816-A |
| titleOfInvention |
Photosensitive resin composition, photosensitive element using the composition, method for forming resist pattern and printed wiring board |
| abstract |
A photosensitive resin composition is characterized in that it comprises (A) a polymer having a carbon-carbon double bond and a carboxyl group which is prepared by a procedure comprising reacting an epoxy compound having a structure obtained by the bonding of a glycidyloxy group to a main chain comprising an aromatic ring, an alkylene group and an oxygen atom with an unsaturated carboxyl compound having a double bond and a carboxyl group and then reacting the resultant reaction product with an acid anhydride, (B) a photopolymerizable monomer, (C) a photopolymerization initiator and (D) a curing agent capable of reacting with functional groups of the above polymer and/or the photopolymerizable monomer. The photosensitive resin composition allows the formation of a solder resist being excellent in characteristics of resolution, intimately contacting property, the resistance to PCT, the resistance to electrolytic corrosion, thermal resistance and impact resistance. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I510855-B |
| priorityDate |
2002-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |